Electrical and Thermal Co-Design for High-Power FPGA...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2018

Electrical and Thermal Co-Design for High-Power FPGA Packages

Shi, Hong, Tan, Siow Chek, Ahn, Jae-Gyung, Refai-Ahmed, Gamal, Ramalingam, Suresh
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Year:
2018
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2789285
File:
PDF, 1.60 MB
english, 2018
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