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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Fabrication and thermal conduction mechanism of epoxy/modified SiCNP polymer composites
Huang, Yun, Zeng, Xiaoliang, Sun, Rong, Xu, Jian-bin, Wong, Ching-pingYear:
2017
Language:
english
DOI:
10.1109/icept.2017.8046544
File:
PDF, 891 KB
english, 2017