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[IEEE 2017 Joint International Symposium on e-Manufacturing and Design Collaboration (eMDC) & Semiconductor Manufacturing (ISSM) - Hsinchu, Taiwan (2017.9.15-2017.9.15)] 2017 Joint International Symposium on e-Manufacturing and Design Collaboration (eMDC) & Semiconductor Manufacturing (ISSM) - Wafer pattern classification and auto disposition by machine learning — James Lin
Kung, Ji Fu, Cheng, Patrick, Hwu, Austin, Wang, Chuang Tse, Hsu, Y BYear:
2017
Language:
english
DOI:
10.23919/ISSM.2017.8089084
File:
PDF, 198 KB
english, 2017