![](/img/cover-not-exists.png)
Copper cladding on polymer surfaces by ionization-assisted deposition
Kohno, Tomoki, Tanaka, Kuniaki, Usui, HiroakiVolume:
57
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.57.03EG11
Date:
March, 2018
File:
PDF, 2.39 MB
english, 2018