[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - A New Fan-Out Package Structure Utilizing the Self-Alignment Effect of Molten Solder to Improve the Die Shift and Enhance the Thermal Properties

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