Fabrication and Characterization of Annular Copper...

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IEEE Transactions on Semiconductor Manufacturing 2018

Fabrication and Characterization of Annular Copper Through-silicon Via for Passive Interposer Applications

Guan, Yong, Ma, Shenglin, Zeng, Qinghua, Chen, Jing, Jin, Yufeng
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Year:
2018
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/TSM.2018.2805279
File:
PDF, 816 KB
english, 2018
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