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Effect of bismuth–tin alloy particle diameter on bonding strength of copper nanoparticles/bismuth–tin solder hybrid joints
Satoh, Toshikazu, Ishizaki, Toshitaka, Usui, MasanoriLanguage:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-018-8704-1
Date:
February, 2018
File:
PDF, 3.54 MB
english, 2018