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A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints
Borgesen, Peter, Wentlent, Luke, Hamasha, Sa’d, Khasawneh, Saif, Shirazi, Sam, Schmitz, Debora, Alghoul, Thaer, Greene, Chris, Yin, LiangLanguage:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-018-6121-0
Date:
February, 2018
File:
PDF, 2.13 MB
english, 2018