![](/img/cover-not-exists.png)
[IEEE 2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM) - Batu Ferringhi, Penang, Malaysia (2017.8.23-2017.8.25)] 2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM) - Numerical simulation of thick metal passivation stress, Part II: Minimizing stress using Response Surface Methodology
Sethu, Raj Sekar, Kho, David, Kulkarni, Salil Hari, Ha, How Ung, Soon, Kok HengYear:
2017
Language:
english
DOI:
10.1109/rsm.2017.8069140
File:
PDF, 385 KB
english, 2017