Control of deposition profile of Cu for large-scale...

Pure & Applied Chemistry 2005 / 01 Vol. 77; Iss. 2

Control of deposition profile of Cu for large-scale integration (LSI) interconnects by plasma chemical vapor deposition

Takenaka, Kosuke, Shiratani, Masaharu, Takeshita, Manabu, Kita, Makoto, Koga, Kazunori, Watanabe, Yukio
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Volume:
77
Language:
english
Journal:
Pure and Applied Chemistry
DOI:
10.1351/pac200577020391
Date:
January, 2005
File:
PDF, 312 KB
english, 2005
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