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[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - High temperature endurable die attach material for power electronics package — Process challenges
Wai, Leong Ching, Ding, Mian Zhi, Tang, Gong YueYear:
2017
DOI:
10.1109/EPTC.2017.8277539
File:
PDF, 1.05 MB
2017