[IEEE 2017 18th International Conference on Electronic...

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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Novel solder ally with wide service temperature capability for automotive applications

Geng, Jie, Zhang, Hongwen, Mutuku, Francis, Lee, Ning-Cheng
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Year:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046762
File:
PDF, 1.69 MB
english, 2017
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