A Study of Process-Induced Residual Stress in PBGA Packages

Journal of Electronic Packaging 2000 Vol. 122; Iss. 3

A Study of Process-Induced Residual Stress in PBGA Packages

Wu, Zhu, Lu, Jian, Guo, Yifan
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Volume:
122
Year:
2000
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1285983
File:
PDF, 534 KB
english, 2000
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