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Stochastic Simulation of Tape Grinding for Wafer-Like Workpiece
Shimada, Keita, Watanabe, Ayaka, Takasu, Yoshifumi, Mizutani, Masayoshi, Kuriyagawa, TunemotoVolume:
874
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.874.91
Date:
October, 2016
File:
PDF, 502 KB
english, 2016