Special issue on Design, Test, Integration and Packaging of...

Microsystem Technologies 2018 / 1 Vol. 24; Iss. 1

Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS, 2016

Nouet, Pascal, Michel, Bernd
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Volume:
24
Language:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-017-3677-1
Date:
January, 2018
File:
PDF, 292 KB
english, 2018
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