Regulating interface adhesion and enhancing thermal...

Regulating interface adhesion and enhancing thermal conductivity of diamond/copper composites by ion beam bombardment and following surface metallization pretreatment

Sang, Jianquan, Yang, Wulin, Zhu, Jiajun, Fu, Licai, Li, Deyi, Zhou, Lingping
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Volume:
740
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2018.01.078
Date:
April, 2018
File:
PDF, 3.16 MB
english, 2018
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