![](/img/cover-not-exists.png)
[IEEE 2017 IEEE CPMT Symposium Japan (ICSJ) - Kyoto (2017.11.20-2017.11.22)] 2017 IEEE CPMT Symposium Japan (ICSJ) - Analysis of the wire/substrate interface during ultrasonic bonding process
Long, Yangyang, Dencker, Folke, Isaak, Andreas, Li, Chun, Wurz, Marc, Twiefel, Jens, Wallaschek, Jorg, Schneider, Friedrich, Hermsdorf, JorgYear:
2017
Language:
english
DOI:
10.1109/icsj.2017.8240117
File:
PDF, 6.11 MB
english, 2017