Co-sputtered Cu(Ti) thin alloy film for formation of Cu...

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Materials Chemistry and Physics 2018 / 2

Co-sputtered Cu(Ti) thin alloy film for formation of Cu diffusion and chip-level bonding

Lin, Po Chen, Chen, Hao, Hsieh, Hsien-Chien, Tseng, Tsan-Hsien, Lee, Hsin Yi, Wu, Albert T.
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Language:
english
Journal:
Materials Chemistry and Physics
DOI:
10.1016/j.matchemphys.2018.01.043
Date:
February, 2018
File:
PDF, 1.63 MB
english, 2018
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