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[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - One micron redistribution for fan-out wafer level packaging
Flack, Warren W., Hsieh, Robert, Nguyen, Ha-Ai, Slabbekoorn, John, Lorant, Christophe, Miller, AndyYear:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277536
File:
PDF, 2.00 MB
english, 2017