[IEEE 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2017.10.25-2017.10.27)] 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Thermal compression bonding challenge: Interposer attachment technology for next generation package-on-package structure
Ji, Jiao-Dong, Liao, Chia-Te, Liao, Chiu-Chen, Lo, Yu-Min, Liu, I-Tang, Huang, Hsiang-Hua, Yu, Kuo-Haw, Lin, Chang-Fu, Chung, Key, Hsiao, C.SYear:
2017
Language:
english
DOI:
10.1109/IMPACT.2017.8255921
File:
PDF, 1.15 MB
english, 2017