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[IEEE 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei (2017.10.25-2017.10.27)] 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Three dimensional auto meshing flexibility for SiP package CAE molding simulation
Li, Kuo-Cheng, Tsai, Yao-Chen, Hsu, Chih-Chung, Huang, Chao-TsaiYear:
2017
Language:
english
DOI:
10.1109/IMPACT.2017.8255951
File:
PDF, 1.33 MB
english, 2017