[IEEE 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei (2017.10.25-2017.10.27)] 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Microstrip signal integrity enhancement by using low-loss solder mask
Hsu, Jimmy, Su, Thonas, Ye, Xiaoning, Lin, CucumberYear:
2017
Language:
english
DOI:
10.1109/IMPACT.2017.8255958
File:
PDF, 1.13 MB
english, 2017