[IEEE 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei (2017.10.25-2017.10.27)] 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Assessment of solder paste technology limitation at miniaturization for SIP and SMT application
Keck, Joanna, Lee, Ning-ChengYear:
2017
Language:
english
DOI:
10.1109/IMPACT.2017.8255961
File:
PDF, 1.51 MB
english, 2017