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[IEEE 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei (2017.10.25-2017.10.27)] 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Novel solder alloy with wide service temperature capability for automotive applications
Geng, Jie, Zhang, Hongwen, Mutuku, Francis, Lee, Ning-ChengYear:
2017
Language:
english
DOI:
10.1109/IMPACT.2017.8255963
File:
PDF, 1.78 MB
english, 2017