[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Effect of Sn grain orientation on Ni substrate dissolution and intermetallic compounds precipitation in Cu/Sn/Ni interconnect undergoing electromigration
Liu, XingBo, Huang, MingliangYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046675
File:
PDF, 1.18 MB
english, 2017