Porous Silicon for Chip Cooling Applications

Physica Scripta 2004 / 01 Vol. T114

Porous Silicon for Chip Cooling Applications

Kan, P Y Y, Finstad, T G, Kristiansen, H, Foss, S E
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Volume:
T114
Language:
english
Journal:
Physica Scripta
DOI:
10.1088/0031-8949/2004/T114/018
Date:
January, 2004
File:
PDF, 536 KB
english, 2004
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