Thermal Hysteresis of MEMS Packaged Capacitive Pressure...

IOP Conference Series Materials Science and Engineering 2016 / 11 Vol. 160

Thermal Hysteresis of MEMS Packaged Capacitive Pressure Sensor (CPS) Based 3C-SiC

Marsi, N, Majlis, B Y, Mohd-Yasin, F, Hamzah, A A, Rus, A Z Mohd
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Volume:
160
Language:
english
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899X/160/1/012037
Date:
November, 2016
File:
PDF, 1.36 MB
english, 2016
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