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Effects of Mn nanoparticle addition on wettability, microstructure and microhardness of low-Ag Sn-0.3Ag-0.7Cu- x Mn(np) composite solders
Tang, Yu, Luo, Shaoming, Li, Guoyuan, Yang, Zhou, Hou, ChaojunLanguage:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/SSMT-10-2017-0027
Date:
February, 2018
File:
PDF, 562 KB
english, 2018