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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Electromigration simulation of flip chip CSP LED
Ma, Rui, Qin, Fei, Fan, Jiajie, Fan, Xuejun, Qian, ChengYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046641
File:
PDF, 805 KB
english, 2017