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[IEEE 2017 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2017.12.2-2017.12.6)] 2017 IEEE International Electron Devices Meeting (IEDM) - Fully aligned via integration for extendibility of interconnects to beyond the 7 nm node
Briggs, Benjamin D., Peethala, C. B., Rath, D. L., Lee, J., Nguyen, S., LiCausi, N. V., McLaughlin, P. S., You, H., Sil, D., Lanzillo, N. A., Huang, H., Patlolla, R., Haigh, T., Xu, Y., Park, C., KerbYear:
2017
Language:
english
DOI:
10.1109/IEDM.2017.8268388
File:
PDF, 458 KB
english, 2017