Thermal Stability of TiN/Ti/p +...

IEEE Electron Device Letters 2018 / 1 Vol. 39; Iss. 1

Thermal Stability of TiN/Ti/p + -Si 0.3 Ge 0.7 Contact With Ultralow Contact Resistivity

Zhang, Jian, Yu, Hao, Wang, Lin-Lin, Schaekers, Marc, Mocuta, D., Horiguchi, Naoto, Collaert, Nadine, De Meyer, Kristin, Jiang, Yu-Long
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Volume:
39
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/led.2017.2771203
Date:
January, 2018
File:
PDF, 1.54 MB
english, 2018
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