[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 2 - Use of Printed Circuit Board as Electrode in EHD-Enhanced Condensation Experiments for a Shell/Tube Bundle Heat Exchanger

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