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[IEEE 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Kamakura, Japan (2017.9.7-2017.9.9)] 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Atoms-to-circuits simulation investigation of CNT interconnects for next generation CMOS technology
Lee, Jaehyun, Liang, Jie, Amoroso, Salvatore M., Sadi, Toufik, Wang, Liping, Asenov, Flamen, Pender, Andrew, Reid, Dave T., Georgiev, Vihar P., Millar, Campbell, Todri-Sanial, Aida, Asenov, AsenYear:
2017
Language:
english
DOI:
10.23919/SISPAD.2017.8085287
File:
PDF, 793 KB
english, 2017