![](/img/cover-not-exists.png)
[IEEE 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Kamakura, Japan (2017.9.7-2017.9.9)] 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Versatile technology modeling for 22FDX platform development
Bazizi, E. M., Zaka, A., Herrmann, T., Cortes, I., Jiang, L., Goh, M. H. J., Deb Roy, S., Nowak, E., Kluth, G., Javorka, P., Pirro, L., Mazurier, J., Harame, D., Kammler, T., Hoentschel, J., SchaefferYear:
2017
Language:
english
DOI:
10.23919/SISPAD.2017.8085340
File:
PDF, 876 KB
english, 2017