[IEEE 2017 18th International Conference on Electronic...

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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - High reliable wire bonding consistency control in MMCM

Zongjie, Han, Wei, Yan, Yongfang, Hu, Xiaoxuan, Li
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Year:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046724
File:
PDF, 1.01 MB
english, 2017
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