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[IEEE 2017 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2017.12.2-2017.12.6)] 2017 IEEE International Electron Devices Meeting (IEDM) - The impact of sequential-3D integration on semiconductor scaling roadmap
Mallik, A., Vandooren, A., Witters, L., Walke, A., Franco, J., Sherazi, Y., Weckx, P., Yakimets, D., Bardon, M., Parvais, B., Debacker, P., Ku, B. W., Lim, S. K., Mocuta, A., Mocuta, D., Ryckaert, J.,Year:
2017
Language:
english
DOI:
10.1109/IEDM.2017.8268483
File:
PDF, 851 KB
english, 2017