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[IEEE 2017 40th International Spring Seminar on Electronics Technology (ISSE) - Sofia, Bulgaria (2017.5.10-2017.5.14)] 2017 40th International Spring Seminar on Electronics Technology (ISSE) - Additive copper metallization of semiconductors for enabling a copper wire bonding process
Hensel, Alexander, Mueller, Martin, Franke, Joerg, von Platen, Klaus KohlmannYear:
2017
Language:
english
DOI:
10.1109/ISSE.2017.8000917
File:
PDF, 879 KB
english, 2017