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[IEEE 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Saratoga Springs, NY, USA (2017.5.15-2017.5.18)] 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Spin coating modeling and planarization using fill patterns for advanced packaging technologies
Lang, Christopher, Boning, DuaneYear:
2017
Language:
english
DOI:
10.1109/asmc.2017.7969228
File:
PDF, 514 KB
english, 2017