Fatigue Life Analysis of Solder Joints in Flip Chip Bonding

Journal of Electronic Packaging 2000 Vol. 122; Iss. 3

Fatigue Life Analysis of Solder Joints in Flip Chip Bonding

Tsukada, Yutaka, Nishimura, Hideo, Sakane, Masao, Ohnami, Masateru
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Volume:
122
Year:
2000
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1286002
File:
PDF, 759 KB
english, 2000
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