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[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Chip-to-Wafer (C2W) flip chip bonding for 2.5D high density interconnection on TSV free interposer
Lim, Sharon Pei-Siang, Ding, Mian Zhi, Kawano, MasayaYear:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277469
File:
PDF, 1.72 MB
english, 2017