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[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Molding process development for Low-Cost MEMS-WLCSP with silicon pillars and Cu wires as vertical interconnections
Ding, Mian Zhi, Lau, Boon Long, Chen, ZhaohuiYear:
2017
DOI:
10.1109/EPTC.2017.8277471
File:
PDF, 1.45 MB
2017