[IEEE 2017 IEEE 19th Electronics Packaging Technology...

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[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Effects of Pd distribution at free air ball in Pd coated Cu wire

Jung, Byung Hoon, Yu, Byung Kwan, Kim, Seung Hyoun, Moon, Jeong Tak, Hong, Sang Jeen
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Year:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277472
File:
PDF, 331 KB
english, 2017
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