[IEEE 2017 IEEE 19th Electronics Packaging Technology...

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[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Visualization of oxide removal during ultrasonic wire bonding process

Long, Yangyang, Dencker, Folke, Isaak, Andreas, Schneider, Friedrich, Hermsdorf, Jorg, Wurz, Marc, Twiefel, Jens
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Year:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277489
File:
PDF, 4.47 MB
english, 2017
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