![](/img/cover-not-exists.png)
[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Impact of 3D stacking on the TSV-induced stress and the CMOS characteristics
Dote, Aki, Tashiro, Hiroko, Kitada, Hideki, Tadaki, Shinji, Miyahara, Shoichi, Sakuyama, SeikiYear:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277496
File:
PDF, 385 KB
english, 2017