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[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Improvement of lifetimetime prediction of silver sintered material in automotive power devices
Yaejima, Ryosuke, Okuno, Shota, Yu, Qiang, Nakata, Yusuke, Sugawara, HiroyukiYear:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277517
File:
PDF, 1.46 MB
english, 2017