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[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Oxide surface roughness optimization of BiCMOS beol wafers for 200 mm wafer level microfluidic packaging based on fusion bonding
Inac, M., Wietstruck, M., Goritz, A., Cetindogan, B., Baristiran-Kaynak, C., Lisker, M., Kruger, A., Trusch, A., Saarow, U., Heinrich, P., Voss, T., Kaynak, M.Year:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277523
File:
PDF, 609 KB
english, 2017