[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Factors affecting activation energy for pd-coated cu ball bond resistance degradation on Al bond pads in high temperature storage
Hook, Michael D., Hunter, Stevan, Mayer, MichaelYear:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277529
File:
PDF, 772 KB
english, 2017