[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Ultra-fine-pitch bonding based on photolithography and electroplating
Li, Dongyang, Dai, Xuhan, Kang, Taegyu, Ding, GuifuYear:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277564
File:
PDF, 2.20 MB
english, 2017