[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
Zoschke, Kai, Guttler, Maurice, Bottcher, Lars, Grubl, Andreas, Husmann, Dan, Schemmel, Johannes, Meier, Karlheinz, Ehrmann, OswinYear:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277579
File:
PDF, 1.37 MB
english, 2017