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[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Comprehensive defect monitoring technique for advanced fanout packaging process
Vangai, Aravindh, Yeoh, Richard, Chang, Wesley, Pan, ShihLin, Kuo, Wei, Pandey, Anuj, Khoo, Kevin, Lakhawat, Rahul, Wang, KootzYear:
2017
Language:
english
DOI:
10.1109/EPTC.2017.8277583
File:
PDF, 235 KB
english, 2017